Because of its low-power and low-noise characteristics, the low-voltage differential-signaling (LVDS) standard technology is an important candidate for the physical layer in high-speed data ...

M-LVDS bus drivers never drive voltages greater than 2.4V, even under conditions of driver contention. This voltage limitation, coupled with the specification for receivers to operate over a wide ...

M-LVDS also limits thedriver short-circuit current to 43 mA, thereby bounding the powerthat the driver can supply to the bus. Finally, the standardrequires disabled drivers to meet the same ...

Backplane bus LVDS breaks new groundRichard Wilson As signal data rates over system backplanes pass the 500Mbit/s level, designers need to make important decisions over the choice of bus interface for ...

Multipoint, low-voltage differential signaling (M-LVDS) is an interface standard similar to LVDS. It provides the benefits of high-speed, low-power, and low-EMI transmission solutions to today's bus ...

Navigation monitors, driver information displays, and backseat entertainment flat panels have inceasingly become a part of standard vehicle equipment. Here, Dr. Thomas Wirschem ...

The serial sub-LVDS format is expected to become Sony's primary image sensor interface for embedded/industrial users. This new image sensor bridge design utilizes the low cost, low power Lattice ...

EINDHOVEN, NETHERLANDS and SAN JOSE, CA-- - At the Intel Developer Forum this week, NXP Semiconductors N.V. will showcase the PTN3460 -- an embedded DisplayPort™-to-LVDS bridge IC ideal for All ...

It uses an FPGA to implement the LVDS standard used by high-pixel-count LCD displays. It contains enough memory for a full frame-buffer, and includes a Motorola-8080 communication standard.

EW Daily News 20/01/2004 11:29:23 – VME board uses 210MHz ADC for real-time video processing Pentek has launched a single-channel 6U VME bus board featuring an Analog Devices 12-bit ...

The UT54LVDS454 LVDS Repeater features four 1.25 Mbps, low power LVDS channels in a small 9 mm x 10 mm ceramic package to deliver the connectivity and SWaP performance required for modern space ...