SiCPAK power modules from Navitas use advanced epoxy-resin potting to achieve 5× lower thermal resistance shift for extended ...

Navitas’ SiCPAK power modules claim a 5× lower thermal resistance shift after 1,000 cycles of thermal shock testing.

Improved Package Internal Connections: Instead of traditional aluminum wedge bond, utilizing aluminum ribbon bonds, copper ...

They are essential for power electronics due to their ability to efficiently dissipate heat. These materials fill the ...

Navitas Semiconductor (Nasdaq: NVTS), the only pure-play, next-generation power semiconductor company and industry leader in ...

Vishay’s ISOA200 thick-film power resistors with optional NTC thermistor and phase-change thermal interface material saves ...

The portfolio of 1200V SiCPAK power modules, enabled by advanced epoxy-resin potting technology, are engineered to withstand ...

enhancing performance in high-power applications. The new modules feature superior reliability and thermal performance, with significantly lower thermal resistance and improved moisture resistance ...

TORRANCE, Calif., April 17, 2025 (GLOBE NEWSWIRE) -- (Nasdaq: NVTS), the only pure-play, next-generation power semiconductor company and industry leader in gallium nitride (GaN) power ICs and silicon ...