Ansys (NASDAQ: ANSS) today announced thermal and multiphysics signoff tool certifications for designs manufactured with Intel 18A process technology. These certifications help ensure functionality ...

The North Side-based space tech company used Ansys’ virtual design and mission planning to calculate the chances of its mission’s success. Astrobotic leveraged the Ansys’ tools to design 20% of the ...

TSMC and Ansys collaborated to create a comprehensive thermal analysis solution for multi-die designs built with TSMC 3 DFabric™, TSMC's comprehensive family of 3 D silicon stacking and advanced ...

ANSYS has announced the availability of the Immersed Boundary module for ANSYS FLUENT 12.0. The new module was jointly developed with Cascade Technologies, Inc. The first release, which is fully ...

FLIR Systems has joined forces with Ansys in an attempt to produce superior hazard detection capabilities for assisted driving. The two companies will also be displaying a thermal-enhanced demo ...

The paper analyzed the thermal stress of aerospace optical cables and connectors, specifically the J599III fiber optic connectors, under various temperature conditions.

PITTSBURGH, April 29, 2025 /PRNewswire/ -- Ansys (NASDAQ: ANSS) today announced thermal and multiphysics signoff tool certifications for designs manufactured with Intel 18A process technology ...

PITTSBURGH, April 29, 2025 /PRNewswire/ -- Ansys (NASDAQ: ANSS) today announced thermal and multiphysics signoff tool certifications for designs manufactured with Intel 18A process technology ...