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Melt infiltrated CMC part and complex body flap assembly achieve key milestone ahead of manufacturing the flight unit for ...
Isovolta has developed CERAPREG to enable CMC parts with long-duration service at 900°C with handling similar to epoxy ...
Motivated by the use of frontal polymerization for the manufacturing of thin layers with thickness down to ∼100 μm, we numerically and experimentally investigate the interplay between the exothermic ...
A simple CVD method, employing the thermally induced reactions of ammonia with decaborane, has been found to generate boron nitride nanosheets (BNNS) on polycrystalline nickel and copper foils. Most ...
In this paper, the impact of substrate resistivity on the functional passive components of radio frequency (RF) complementary metal-oxide-semiconductor circuits for system-on-a-chip applications is ...
Direct copper bonding (DCB) substrate consisting of an Al2O3-ceramic layer in between two thick copper layers is one of the most powerful ceramic substrates for electronic applications. During the ...
Honeycomb Ceramic Carrier Market Analysis and Latest Trends Honeycomb Ceramic Carriers are advanced materials widely used in applications such as catalysis, gas treatment, and thermal management due ...