Through-silicon-vias (TSVs) are prone to defects during the manufacturing process, which pose yield challenges for three dimensional integrated circuits (3D-ICs). The area per TSV is too great to be ...

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Novel closed-form expressions for effective material properties of honeycomb radar-absorbing structure (RAS) are proposed. These expressions, which are derived from strong fluctuation theory with ...

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Official implementation of T-PAMI25 paper "M²Diffuser: Diffusion-based Trajectory Optimization for Mobile Manipulation in 3D Scenes" - m2diffuser/M2Diffuser ...