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Electronics3601d
Major challenges in chiplet-based designs
Challenges include probing fine-pitch micro-bumps and maintaining test access throughout 3D stacks. Solutions include ...
IEEE23h
Learn About IEEE Membership
These three pillars represent the core experiences that make up IEEE membership and the reason that nearly half a million technologists worldwide make IEEE an integral part of their lives. In this ...
The New York Times3d
Art and Design - The New York Times
Art, architecture and design news. Criticism and reviews from co-chief art critics Roberta Smith and Holland Cotter and architecture critic Michael Kimmelman.
IEEE2d
Analysis of Threshold Voltage Options on Flip-Flop SEU Performance at GF 12-nm FinFET Node | IEEE Conference Publication | IEEE Xplore
Date Added to IEEE Xplore: 26 November 2024 ISBN Information: Electronic ISBN: 979-8-3503-8207-5 Print on Demand(PoD) ISBN: 979-8-3503-8208-2 ISSN Information: ... Flip-flops using LVT/RVT/HVT options ...