A 512 MEMS mirror array module with a hermetically sealed package for large optical cross-connects is constructed by using newly developed multi-chip direct mounting (MCDM) technology and is ...

This paper presents a novel single-chip high-overload multi-wheel-ring tri-axial MEMS resonant gyroscope with a geometric diameter of 3mm. It comprises a ring structure for Z-axis sense and a wheel ...

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Prakash Govindan, Gradiant’s co-founder and COO, discusses the challenges facing both the data centre and semiconductor industries when it comes to water usage.

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