This paper presents a novel single-chip high-overload multi-wheel-ring tri-axial MEMS resonant gyroscope with a geometric diameter of 3mm. It comprises a ring structure for Z-axis sense and a wheel ...

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In this paper, a heat conduction structure (HCS) is designed to conduct the concentrated heat on the etched wafer in the etching process of MEMS devices with support anchors. During the reactive ion ...