Sub-micron 3D printing has enabled the production of microoptical components for new light-based computing technologies. Newsletters Games Share a News Tip Featured ...

Three-dimensional (3D) integration has opened new possibilities for the development of denser circuits with more interconnected electronic components. 3D integration approaches entail stacking ...

Rob Peglar from Micron presented this talk at the 2016 MSST Conference. "The growing demands of mobile computing and data centers continue to drive the need for high-capacity, high-performance NAND ...

Multiyear agreement to enable best-in-class system-on-chips (SoCs) for the AI, high performance computing (HPC) and mobile markets. Joint development on customized intellectual property (IP ...

Today, AMD announced the Ryzen 9 7945HX3D processor, a groundbreaking addition to the company’s renowned Ryzen Series processors and the first mobile processor with AMD 3D V-Cache.

“OpenGL ES 3.1 provides the most desired features of desktop OpenGL 4.4 in a form suitable for mobile devices,” said Tom Olson, chair of the OpenGL ES working group and Director of Graphics ...

San Francisco, CA. Leti, a CEA Tech institute, today announced it has developed a new on-chip communications system to improve high-performance computing (HPC) that is faster and more energy ...