News

EE World Online11h
MPU features dual-layer PCB compatibility and 2D graphics engine for HMI systems
Renesas Electronics Corporation introduced a new high-performance microprocessor (MPU) in the RTOS-based RZ/A series that ...
Semiconductor Engineering1d
Transformation Of 2D-ICs Into 3D-ICs Using Shuttle Chips From Multi-Project Wafers (Tohoku University)
Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by ...