Dual-damascene copper metallization has been the mainstream technology of forming interconnections for IC devices. Defect formation during Cu metallization is one of main yield-limiting factors in IC ...

High-resolution electron microscopy (HREM) imaging technique is a powerful tool for directly visualizing a broad range of materials in real-space. However, it faces challenges in denoising due to ...

The specimen, precisely positioned in the focal point of the parabolic mirror, emits light that is transformed to a parallel beam by the mirror and directed outside the microscope for in-depth ...