The emerging wafer-level packaging (WLP) technology suffers from serious signal integrity (SI) and power integrity (PI) issues due to its redistribution layer (RDL). There exhibit serious parasitic ...

Los Angeles prosecutors filed theft charges against a group of seven people who allegedly stole more than $1 million worth of ...

Reflections from a recent panel discussion at DAC, The Chips to Systems Conference held at Moscone West on the CHIPS Act's impact on the design ecosystem ...

Generally speaking, designing single-phase phaselocked loops (PLLs) is more complicated than three-phase ones, as their implementation often involves the generation of a fictitious orthogonal signal ...