SiCPAK power modules from Navitas use advanced epoxy-resin potting to achieve 5× lower thermal resistance shift for extended ...

Improved Package Internal Connections: Instead of traditional aluminum wedge bond, utilizing aluminum ribbon bonds, copper ...

Navitas’ SiCPAK power modules claim a 5× lower thermal resistance shift after 1,000 cycles of thermal shock testing.

They are essential for power electronics due to their ability to efficiently dissipate heat. These materials fill the ...

MEMS Labs, Inc. has announced the extension of its µCooling fan-on-a-chip technology into AI data centers, providing an ...

Navitas Semiconductor (Nasdaq: NVTS), the only pure-play, next-generation power semiconductor company and industry leader in ...

enhancing performance in high-power applications. The new modules feature superior reliability and thermal performance, with significantly lower thermal resistance and improved moisture resistance ...

The portfolio of 1200V SiCPAK power modules, enabled by advanced epoxy-resin potting technology, are engineered to withstand ...

The latest in SiC technology offers fast switching, cool operation, compact design, and high efficiency for automotive and ...

SemiQ has announced a series of highly efficient 1200 V SiC MOSFET Six-Pack Modules. These have been designed to enable lower ...