SiCPAK power modules from Navitas use advanced epoxy-resin potting to achieve 5× lower thermal resistance shift for extended ...

Navitas’ SiCPAK power modules claim a 5× lower thermal resistance shift after 1,000 cycles of thermal shock testing.

Improved Package Internal Connections: Instead of traditional aluminum wedge bond, utilizing aluminum ribbon bonds, copper ...

Navitas Semiconductor (Nasdaq: NVTS), the only pure-play, next-generation power semiconductor company and industry leader in ...

MEMS Labs, Inc. has announced the extension of its µCooling fan-on-a-chip technology into AI data centers, providing an ...

enhancing performance in high-power applications. The new modules feature superior reliability and thermal performance, with significantly lower thermal resistance and improved moisture resistance ...

The portfolio of 1200V SiCPAK power modules, enabled by advanced epoxy-resin potting technology, are engineered to withstand ...

The latest in SiC technology offers fast switching, cool operation, compact design, and high efficiency for automotive and ...

SemiQ has announced a series of highly efficient 1200 V SiC MOSFET Six-Pack Modules. These have been designed to enable lower ...

Advanced Thermal Solutions, Inc. (ATS) has launched an active heat sink series engineered for cooling NVIDIA Jetson Orin™ NX ...

SemiQ Inc has announced a family of co-packaged 1200 V SOT-227 MOSFET modules based on its third-generation SiC technology.