LG Innotek looks to future tech innovations for smartphones to make them slimmer by replacing solder balls with Copper Posts, ...

LG Innotek is continuing its quest to become the world's top company in the field of technology components, with its latest ...

The next-gen substrate allows for denser circuitry for smaller, higher-performance semiconductor substrates, and improved ...

Innotek recently announced a significant advancement in semiconductor substrate technology called copper post, or Cu-Post, that’s starting to be mass-produced.

LG Innotek plans to grow its semiconductor components business, with high-value-added substrates such as FC-BGA and RF-SiP and vehicle AP modules as its mainstay products, to achieve an annual ...

LG Innotek introduced Copper Post packaging technology, which replaces traditional solder balls in semiconductor substrates, ...

LG Group has introduced its latest in-vehicle technologies during a private presentation held at Honda Motor Company’s ...

LG Innotek announced on the 25th that it has successfully developed and mass-produced the 'copper post (Cu-Post)' technology, which is applied to high-value semiconductor substrates for mobile use, ...