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Semiconductor Engineering
3h
InRak Kim
The conventional flip chip ball grid array (FCBGA) package platform has wide industry usage and provides high electrical ...
Semiconductor Engineering
9h
Managing EMI in High-Density Integration
Controlling interference in today’s SoCs and advanced packaging requires a combination of innovative techniques, but new ...
Semiconductor Engineering
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New Materials Are in High Demand
Development methodologies combine old and new techniques, but getting any new material into high-volume manufacturing is a ...
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