Pros and cons of replacing copper with optical in data-intensive AI systems.

Use the most advanced AI technology to optimize an entire SoC within a single platform with a small design team.

Post-route signal integrity for PCBs; memory expansion and sharing; interconnects for AI clusters; LPCAMM2; MEMS ...

China's 3nm chip; state of the industry supply chain; imec's next big push; hyper-dimensional AI chip; OpenAI's $6.5B startup ...

News and insights from imec ITF World 2025.

Researchers from Oak Ridge National Laboratory and National Cheng Kung University developed a technique called scanning ...

A technical paper titled “Uncovering the doping mechanism of nitric oxide in high-performance P-type WSe2 transistors” was ...

Heterogeneous integration — an umbrella term that covers many different applications and packaging requirements — holds the ...

When the via impedance value cannot be determined, evaluating the signal transmission provides a viable alternative.

Quickly screen large amounts of possible materials for specific properties and select promising candidates for deeper ...

This is particularly promising for cooling stacks of silicon, where the top of the stack can easily lose its heat to the ...

Evolving lithography demands are challenging mask writing technology; shift to curvilinear is underway.