Artists often find supplies in surprising places. For Clifford “CW” Roelle, industrial wire procured from the same place one ...

New challenges for wafer metrology solutions have evolved with 3D-IC manufacturing technology. 3D-IC technology allows stacking single chips, electrically connecting them in the vertical direction, ...

We present a method for reconstructing 3D surface as triangular meshes from imagery. The surface reconstruction requires 3D point cloud for composing vertices of triangle meshes. A standard approach ...