News
Kenmec Mechanical Engineering is using Nvidia's Omniverse platform to transform factory construction, enabling "one-click ...
Aibuild, a leading innovator in advanced manufacturing software, introduced the BETA release of its new Finite Element ...
This paper reports on the use of TCAD for thermal simulation of GaN-on-SiC HEMT RF power transistors. Firstly, the results are compared with those obtained using ANSYS Mechanical Pro, then the ...
Synopsys' recent accolades, including the 2025 Frost & Sullivan Technology Innovation Leadership Award, underscore its dominance in AI-driven EDA. Its tools—such as PrimeSim™ , Custom Compiler™, and ...
Simulation, AI, and digital twins are driving scalable engineering solutions in the 5th-generation industrial tech era.
Thermal stress-strain simulation analysis of BGA solder joint reflow soldering process - IEEE Xplore
A three-dimensional finite element analysis model of BGA components was established. Using ANSYS, this model was subjected to stress-strain finite element simulation analysis under thermal-structure ...
Synopsys leads in EDA and IP with strong long-term potential, but high valuation and integration risks warrant caution. Find ...
With support from Ansys and its channel partner CADFEM Germany GmbH, Wingcopter is using advanced simulation tools to make faster, more accurate design decisions—helping to deliver medical items ...
Detailed price information for Ubiquiti Networks (UI-N) from The Globe and Mail including charting and trades.
Some results have been hidden because they may be inaccessible to you
Show inaccessible results