A tectonic clash in Tibet formed giant copper deposits, revealing how recycled crust can power clean energy and reshape ...

Dual-damascene copper metallization has been the mainstream technology of forming interconnections for IC devices. Defect formation during Cu metallization is one of main yield-limiting factors in IC ...

Electron Paramagnetic Resonance Study of Copper–Ethylenediamine Complex Ion Intercalated in Bentonite José Pedro Donoso * , Claudio J. Magon , José F. Lima , Otaciro R. Nascimento , Eglantina ...

Ascorbate oxidase (E.C. 1.10.3.3) of the squash C. pepo medullosa was investigated by electron paramagnetic resonance (EPR); redox titrations of the different copper sites were carried out ...