Assessment of proper material specifications at the substrate level is mandatory for successful high-performances SiC power devices. However, SiC defects must be screened during device fabrication ...

A major challenge in metal 3D printing is controlling the microstructure, which determines a material’s mechanical properties. One key factor is the formation of dislocations: defects in the crystal ...

In the process of production and long-term service, different forms of defects and microstructure changes are easily produced in solid materials, which leads to the degradation of mechanical and ...

Dr. Mitsutaka Haruta (presently, in NIMS) and Assoc. Prof. Horoki Kurata (Institute for Chemical Research) demonstrated the direct observation of molecular column in organic crystals using a scanning ...

Defects in multicrystalline silicon wafers after saw-damage etch (SDE) for different etch durations are characterized nondestructively using scanning electron acoustic microcopy (SEAM). SEAM is shown ...

Even after two decades of research, conventional 111 B oriented III–V nanowires are often perturbed by twins and stacking faults that form perpendicular to their growth direction and span the ...

The ability to view individual atoms allows for a better understanding of a material’s physical and mechanical properties. For example, HR-TEM characterization can be utilized to identify unusual ...

An international team of researchers, led by University of Toronto Engineering Professor Yu Zou, is using electric fields to control the motion of material defects. This work has important ...

Crystallographic defects within the SiC wafer and surface defects near or at the wafer surface are the major defects in SiC. Crystallographic defects include grain boundaries, micropipes, threading ...