Motivated by the use of frontal polymerization for the manufacturing of thin layers with thickness down to ∼100 μm, we numerically and experimentally investigate the interplay between the exothermic ...

In this article, we address the Release 13 of the NB-IoT 3rd generation partnership project (3GPP) standardized LPWA technology and provide a tutorial on its physical layer (PHY) design.

In the most advanced automotive applications, where high frequency signals, design density, high pin-count, miniaturization and integration dominate the scene, the use of Ball Grid Array (BGA) package ...