We realized low-ohmic, high-speed interconnects to transfer-printed, 20 μm thick electronic chiplets with small (20 μm×20μm) pads. Spray-coated divinylsiloxane-bis-benzocyclobuten (DVS-BCB) ramps were ...

Compound semiconductors provide exceptional electronic and photonic functionality and integration of these properties into photonic circuits will enable high performance systems. One integration ...