The new paints were able to keep surfaces between 5C and 20C cooler than normal paint – which could save significant ...

In today’s rapidly urbanizing world, the need for sustainable and energy-efficient solutions is becoming increasingly urgent. The advent of smart ...

The introduction, testing, and availability of uPSP is the result of a successful five-year-long effort, begun in 2019, in ...

In the post-Moore era, the chiplet technology based on advanced packaging would be a quite promising solution for the high-performance AI chips. The chiplet technology with 2.5D/3D stacking package ...