Double-sided cooling based on planar packaging method features better thermal performance than traditional single-sided cooling based on wire bonds. However, this method still faces thermal and ...

Various package level thermal management schemes are discussed. Extensive sensitivity study data of thermally conductive packaging materials such as die adhesive, mold compound, and board level ...

Effect of acid-alcoholic treatment on the thermal, structural and pasting characteristics of European chestnut (Castanea sativa, Mill) starch. J Therm Anal Calorim. 2018;131:587-94. 43 García NL, Famá ...