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LG Innotek looks to future tech innovations for smartphones to make them slimmer by replacing solder balls with Copper Posts, ...
LG Group has introduced its latest in-vehicle technologies during a private presentation held at Honda Motor Company’s ...
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Tom's Hardware on MSNLG Innotek to slim down smartphones by replacing solder balls with copper postsLG Innotek introduced Copper Post packaging technology, which replaces traditional solder balls in semiconductor substrates, ...
LG Group is hosting a private "Tech Day" event at the headquarters of Japan’s Honda Motor Co. this week, underscoring its ...
The next-gen substrate allows for denser circuitry for smaller, higher-performance semiconductor substrates, and improved ...
Innotek recently announced a significant advancement in semiconductor substrate technology called copper post, or Cu-Post, that’s starting to be mass-produced.
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