LG Innotek introduced Copper Post packaging technology, which replaces traditional solder balls in semiconductor substrates, ...

The next-gen substrate allows for denser circuitry for smaller, higher-performance semiconductor substrates, and improved ...

LG Innotek said Wednesday it has developed a next-generation semiconductor substrate technology that can reduce smartphone thickness while improving heat dissipation — a longstanding challenge in high ...

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LG Innotek (CEO Moon Hyuksoo, 011070) announced on June 9, 2025, that it has successfully developed the world's first 'Third-generation Automotive 5G Communication Module' that supports satellite ...

Collaboration will enable the development of a new vision sensing system that will put world-leading LG Innotek cameras in Atlas SEOUL, South Korea, May 12, 2025 /PRNewswire/ -- LG Innotek is ...

LG Innotek to build FC-BGA into 700 million USD business by 2030 with its state-of-the-art Dream Factory. PR Newswire. SEOUL, South Korea, April 30, 2025.

LG Innotek looks to future tech innovations for smartphones to make them slimmer by replacing solder balls with Copper Posts, ...